Substrate material technology and production, has gone through half a century of development, the world's annual output has reached 290 million square meters, this development has always been electronic machinery products, semiconductor manufacturing technology, electronics installation technology, printed circuit board technology, innovation-driven development.
Since 1943, with the phenolic resin matrix produced by CCL begun to enter the practical use has been very rapid development of substrate materials. In 1959, Texas Instruments Inc. to produce the first integrated circuit on the printed circuit board made a higher high-density assembly requirements, thus contributing to the laminate production. In 1961, the U.S. Hazeltine Corpot ation of metal-based company successfully developed the law through-hole multilayer process technology. In 1977, BT resin, the industrialization of production, the development of the world also provides a multilayer high and low Tg of the new substrate material.
IBM, released in Japan in 1990, using photosensitive resin as the insulating layer Multilayer Build-up of new technologies, in 1997, including the laminated plywood, including high-density multilayer interconnect technology toward the development of maturity. At the same time, to BGA, CSP as the typical representative of the plastic substrate has been rapid development. The 20th century, the late 90s, which does not contain bromine and antimony flame-retardant and other new green substrate is rising rapidly, to enter the market.
Substrate materials in China have been more than 40 years of development, has formed about 90 billion yuan annual output value of the scale of production. In 2000, CCL China mainland has reached 64 million square meters total, the highest output value of 5.5 billion. The output of paper-based copper clad laminate which has been among the world's third highest.
But in the technical level, product variety, in particular, is a new substrate development, with foreign advanced countries, there are still a considerable gap. Printed circuit board (PCB) is a glass epoxy substrate adhesive layer copper, copper foil thickness usually 18¦Ìm, 35¦Ìm, 55¦Ìm, and 70¦Ìm4 kinds. The most commonly used copper foil thickness of 35¦Ìm. Domestic adoption copper thickness of 35 ~ 50¦Ìm, are also thinner than that of, such as 10¦Ìm, 18¦Ìm;, and than this thick as 70¦Ìm. l ~ 3mm thick substrate composite copper foil thickness of about 35¦Ìm; less than lmm thick substrate composite copper foil thickness of about 18¦Ìm, 5mm or more thick substrate copper foil thickness of about Composite 55¦Ìm. If the PCB on the copper foil thickness is 35¦Ìm, printing width 1mm, for each 10mm long, the resistance value 5m¦¸ about the inductance of 4nH around. When the PCB on the work of digital integrated circuit chip di / dt for the 6mA/ns, operating current of 30mA, each 10mm long production line contained in the resistance and inductance values to estimate the value of the various parts of the circuit noise voltage generated by respectively 0.15 mV and 24mV.
